32-bit RISC microprocessor featuring a 100MHz ColdFire core. This surface-mount device utilizes a 256-pin MAP-BGA package with a 1mm pitch, measuring 17x17x1.16mm. Integrated peripherals include CAN, Ethernet (MII, 10/100Mbps), I2C, and three UARTs. Operating voltage ranges from 1.6V to 3.6V, with an operating temperature range of -40°C to 85°C. Includes 8KB instruction and 8KB data caches.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MCF5235CVM100J technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | MAP-BGA |
| Package Description | Molded Array Process Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 256 |
| PCB | 256 |
| Package Length (mm) | 17 |
| Package Width (mm) | 17 |
| Package Height (mm) | 1.16 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 1 |
| Package Weight (g) | 0.7748 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BBA |
| Family Name | ColdFire MCF5xxx Processor |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | ColdFire |
| Maximum Speed | 100MHz |
| Number of CPU Cores | 1 |
| Interface Type | CAN/Ethernet/I2C/SPI/UART |
| CAN | 1 |
| UART | 3 |
| USART | 0 |
| I2C | 1 |
| SPI | 1 |
| USB | 0 |
| Ethernet | 1 |
| I2S | 0 |
| Max Operating Supply Voltage | 1.6|3.6V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Instruction Cache Size | 8KB |
| Data Cache Size | 8KB |
| Multiply Accumulate | Yes |
| Ethernet Interface Type | MII |
| Ethernet Speed | 10Mbps/100Mbps |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A002.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP MCF5235CVM100J Datasheet
Download the complete datasheet for NXP MCF5235CVM100J to view detailed technical specifications.
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