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Technical Specifications
NXP MCF5275LCVM133 technical specifications.
General
Access Time
133us
Package/Case
LBGA
Core Architecture
Coldfire
Halogen Free
Halogen Free
Interface
I2C, SPI, USB, Ethernet, UART, USART, EBI/EMI
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Type
ROMless,
Min Operating Temperature
-40°C
Number of I/Os
61
Oscillator Type
External
Packaging
Tray
Peripherals
WDT, DMA
RAM Size
65536B
RoHS Compliant
Yes
Series
MCF527x
Compliance
RoHS
Compliant
Datasheet
NXP MCF5275LCVM133 Datasheet
Download the complete datasheet for NXP MCF5275LCVM133 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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