Frequency166MHz
PackageLBGA
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Technical Specifications
NXP MCF5275LCVM166J technical specifications.
General
Package/Case
LBGA
Core Architecture
Coldfire
Data Bus Width
32b
Halogen Free
Halogen Free
Interface
I2C, SPI, USB, Ethernet, UART, USART, EBI/EMI
Lead Free
Lead Free
Max Frequency
166MHz
Max Operating Temperature
85°C
Memory Type
ROMless,
Min Operating Temperature
-40°C
Number of I/Os
61
Oscillator Type
External
Package Quantity
126
Packaging
Tray
Peripherals
WDT, DMA
Radiation Hardening
No
RAM Size
64KB
RoHS Compliant
Yes
Series
MCF527x
Weight
0.017021oz
Compliance
RoHS
Compliant
Datasheet
NXP MCF5275LCVM166J Datasheet
Download the complete datasheet for NXP MCF5275LCVM166J to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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