32-bit RISC microprocessor featuring a ColdFire core architecture operating at up to 240 MHz. This single-core MPU offers 16KB instruction and 16KB data cache, with Multiply Accumulate capability. It includes Ethernet (MII, 10/100Mbps), I2C, I2S, SPI, and 3 UART interfaces. Packaged in a 196-pin MAP-BGA (15x15x1.16mm) for surface mounting, it supports a wide operating voltage range of 1.6V to 3.6V and operates from -40°C to 85°C.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MCF5373LCVM240J technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
196
PCB
196
Package Length (mm)
15
Package Width (mm)
15
Package Height (mm)
1.16
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Family Name
ColdFire MCF53xx Processor
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
ColdFire
Maximum Speed
240MHz
Core Architecture
ColdFire
Number of CPU Cores
1
Interface Type
Ethernet/I2C/I2S/SPI/UART
CAN
0
UART
3
USART
0
I2C
1
SPI
1
USB
0
Ethernet
1
I2S
1
Max Operating Supply Voltage
1.6|1.95|2.75|3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Instruction Cache Size
16KB
Data Cache Size
16KB
Multiply Accumulate
Yes
Ethernet Interface Type
MII
Ethernet Speed
10Mbps/100Mbps
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A002
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MCF5373LCVM240J Datasheet
Download the complete datasheet for NXP MCF5373LCVM240J to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.