32-bit RISC microprocessor featuring a ColdFire core, operating at a maximum speed of 240 MHz. This surface-mount device utilizes 0.13um process technology and offers 16KB instruction and 16KB data cache. It supports I2C, SPI, SSI, and UART interfaces, with a single CPU core and multiply-accumulate functionality. Packaged in a 256-pin MAP-BGA with a 1mm pin pitch, it operates within a 1.65V to 3.6V supply voltage range and has an operating temperature range of 0°C to 70°C.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MCF54450VM240J technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1.16
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
1
Package Weight (g)
0.7748
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BFB
Family Name
ColdFire MCF5445X Processor
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
ColdFire
Maximum Speed
240MHz
Process Technology
0.13um
Number of CPU Cores
1
Interface Type
I2C/SPI/SSI/UART
Max Operating Supply Voltage
1.65|3.6V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Instruction Cache Size
16KB
Data Cache Size
16KB
Multiply Accumulate
Yes
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MCF54450VM240J Datasheet
Download the complete datasheet for NXP MCF54450VM240J to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.