32-bit RISC microprocessor featuring a ColdFire core, operating at a maximum speed of 240 MHz. This surface-mount device utilizes 0.13um process technology and offers 16KB instruction and 16KB data cache. It supports I2C, SPI, SSI, and UART interfaces, with a single CPU core and multiply-accumulate functionality. Packaged in a 256-pin MAP-BGA with a 1mm pin pitch, it operates within a 1.65V to 3.6V supply voltage range and has an operating temperature range of 0°C to 70°C.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MCF54450VM240J technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | MAP-BGA |
| Package Description | Molded Array Process Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 256 |
| PCB | 256 |
| Package Length (mm) | 17 |
| Package Width (mm) | 17 |
| Package Height (mm) | 1.16 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 1 |
| Package Weight (g) | 0.7748 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BFB |
| Family Name | ColdFire MCF5445X Processor |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | ColdFire |
| Maximum Speed | 240MHz |
| Process Technology | 0.13um |
| Number of CPU Cores | 1 |
| Interface Type | I2C/SPI/SSI/UART |
| Max Operating Supply Voltage | 1.65|3.6V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Instruction Cache Size | 16KB |
| Data Cache Size | 16KB |
| Multiply Accumulate | Yes |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.2 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP MCF54450VM240J Datasheet
Download the complete datasheet for NXP MCF54450VM240J to view detailed technical specifications.
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