Frequency200MHz
PackageBGA
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Technical Specifications
NXP MCF5473VR200 technical specifications.
General
Package/Case
BGA
Core Architecture
Coldfire
Data Bus Width
32b
Halogen Free
Halogen Free
Interface
I2C, SPI, USB, Ethernet, UART, USART, EBI/EMI
Lead Free
Lead Free
Max Frequency
200MHz
Max Operating Temperature
70°C
Memory Type
ROMless,
Min Operating Temperature
0°C
Number of I/Os
99
Operating Supply Voltage
3.6V
Oscillator Type
External
Package Quantity
40
Packaging
Tray
Peripherals
PWM, WDT, DMA
Radiation Hardening
No
RAM Size
32KB
RoHS Compliant
Yes
Series
MCF547x
Weight
0.113935oz
Compliance
RoHS
Compliant
Datasheet
NXP MCF5473VR200 Datasheet
Download the complete datasheet for NXP MCF5473VR200 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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