Frequency454MHz
PackageLFBGA
MountingSurface Mount
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Technical Specifications
NXP MCIMX233DJM4CR2 technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
32b
Halogen Free
Halogen Free
Interface
I2C, SPI, USB, MMC, UART, USART, EBI/EMI
Max Frequency
454MHz
Max Operating Temperature
70°C
Memory Size
64KB
Memory Type
ROM, L1 Cache,
Min Operating Temperature
-10°C
Mount
Surface Mount
Number of I/Os
95
Oscillator Type
External
Package Quantity
1500
Packaging
Tape and Reel
Peripherals
POR, PWM, WDT, DMA, LCD
Radiation Hardening
No
RAM Size
32KB
Series
i.MX23
Weight
0.009891oz
Compliance
RoHS
Compliant
Datasheet
NXP MCIMX233DJM4CR2 Datasheet
Download the complete datasheet for NXP MCIMX233DJM4CR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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