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Technical Specifications
NXP MCIMX253DVM4 technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Interface
I2C, SPI, USB, Ethernet, MMC, UART, USART, EBI/EMI, 1-WIRE
Max Operating Temperature
70°C
Memory Type
External Program Memory,
Min Operating Temperature
-20°C
Min Supply Voltage
1.38V
Mount
Surface Mount
Number of I/Os
128
Oscillator Type
External
Package Quantity
90
Packaging
Tray
Peripherals
POR, PWM, WDT, DMA, LCD
Radiation Hardening
No
RoHS Compliant
Yes
Series
i.MX25
Compliance
RoHS
Compliant
Datasheet
NXP MCIMX253DVM4 Datasheet
Download the complete datasheet for NXP MCIMX253DVM4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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