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Technical Specifications
NXP MCIMX257CJN4A technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
32b
Interface
I2C, SPI, USB, CAN, Ethernet, MMC, UART, USART, EBI/EMI, 1-WIRE
Max Operating Temperature
85°C
Memory Type
ROM, L1 Cache, External Program Memory,
Min Operating Temperature
-40°C
Min Supply Voltage
1.38V
Mount
Surface Mount
Number of I/Os
128
Operating Supply Voltage
1.52V
Oscillator Type
External
Package Quantity
189
Packaging
Tray
Peripherals
POR, PWM, WDT, DMA, LCD
Radiation Hardening
No
RAM Size
128KB
RoHS Compliant
Yes
Series
i.MX25
Weight
0.014371oz
Compliance
RoHS
Compliant
Datasheet
NXP MCIMX257CJN4A Datasheet
Download the complete datasheet for NXP MCIMX257CJN4A to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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