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Technical Specifications
NXP MCIMX27VJP4AR2 technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
32b
Halogen Free
Halogen Free
Interface
I2C, SPI, USB, CAN, Ethernet, MMC, UART, USART, EBI/EMI, 1-WIRE
Max Operating Temperature
85°C
Memory Type
ROM, L1 Cache, ROMless,
Min Operating Temperature
-20°C
Min Supply Voltage
1.38V
Mount
Surface Mount
Operating Supply Voltage
1.52V
Oscillator Type
External
Package Quantity
1000
Packaging
Tape and Reel
Peripherals
POR, PWM, WDT, DMA, LCD
Radiation Hardening
No
RoHS Compliant
Yes
Series
i.MX27
Weight
0.022672oz
Compliance
RoHS
Compliant
Datasheet
NXP MCIMX27VJP4AR2 Datasheet
Download the complete datasheet for NXP MCIMX27VJP4AR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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