PackageLFBGA
MountingSurface Mount
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Technical Specifications
NXP MCIMX31CVMN4DR2 technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
32b
Halogen Free
Halogen Free
Lead Free
Lead Free
Max Operating Temperature
85°C
Memory Type
ROM, L2 Cache
Min Operating Temperature
-40°C
Max Supply Voltage
1.47V
Mount
Surface Mount
Number of Cores
1
Package Quantity
750
Packaging
Tape and Reel
Radiation Hardening
No
Series
i.MX31
Weight
0.032431oz
Compliance
RoHS
Compliant
Datasheet
NXP MCIMX31CVMN4DR2 Datasheet
Download the complete datasheet for NXP MCIMX31CVMN4DR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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