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NXP MCIMX31CVMN4DR2 technical specifications.
| Package/Case | LFBGA |
| Core Architecture | ARM |
| Data Bus Width | 32b |
| Halogen Free | Halogen Free |
| Lead Free | Lead Free |
| Max Operating Temperature | 85°C |
| Memory Type | ROM, L2 Cache |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 1.47V |
| Mount | Surface Mount |
| Number of Cores | 1 |
| Package Quantity | 750 |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| Series | i.MX31 |
| Weight | 0.032431oz |
| RoHS | Compliant |
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