Frequency400MHz
PackageLFBGA
MountingSurface Mount
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Technical Specifications
NXP MCIMX31LCVMN4DR2 technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
32b
Halogen Free
Halogen Free
Lead Free
Lead Free
Max Frequency
400MHz
Max I/O Voltage
3.3V
Max Operating Temperature
85°C
Max Supply Voltage
1.47V
Memory Type
ROM, L2 Cache
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of Cores
1
Package Quantity
750
Packaging
Tape and Reel
Radiation Hardening
No
RAM Size
16KB
Series
i.MX31
Weight
0.032431oz
Compliance
RoHS
Compliant
Datasheet
NXP MCIMX31LCVMN4DR2 Datasheet
Download the complete datasheet for NXP MCIMX31LCVMN4DR2 to view detailed technical specifications.
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