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Technical Specifications
NXP MCIMX31LDVKN5DR2 technical specifications.
General
| Package/Case | LFBGA |
| Core Architecture | ARM |
| Data Bus Width | 32b |
| Max Operating Temperature | 70°C |
| Memory Type | ROM, L2 Cache |
| Min Operating Temperature | -20°C |
| Mount | Surface Mount |
| Number of Cores | 1 |
| Operating Supply Voltage | 1.65V |
| Package Quantity | 1000 |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Series | i.MX31 |
| Weight | 0.01496oz |
Compliance
| RoHS | Compliant |
Datasheet
NXP MCIMX31LDVKN5DR2 Datasheet
Download the complete datasheet for NXP MCIMX31LDVKN5DR2 to view detailed technical specifications.
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