PackageLFBGA
MountingSurface Mount
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Technical Specifications
NXP MCIMX31LDVKN5DR2 technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
32b
Max Operating Temperature
70°C
Memory Type
ROM, L2 Cache
Min Operating Temperature
-20°C
Mount
Surface Mount
Number of Cores
1
Operating Supply Voltage
1.65V
Package Quantity
1000
Packaging
Tape and Reel
Radiation Hardening
No
RoHS Compliant
Yes
Series
i.MX31
Weight
0.01496oz
Compliance
RoHS
Compliant
Datasheet
NXP MCIMX31LDVKN5DR2 Datasheet
Download the complete datasheet for NXP MCIMX31LDVKN5DR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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