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Technical Specifications
NXP MCIMX31LDVMN5D technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Max Operating Temperature
70°C
Min Operating Temperature
-20°C
Mount
Surface Mount
Number of Cores
1
Packaging
Tray
Radiation Hardening
No
RoHS Compliant
Yes
Series
i.MX31
Compliance
RoHS
Compliant
Datasheet
NXP MCIMX31LDVMN5D Datasheet
Download the complete datasheet for NXP MCIMX31LDVMN5D to view detailed technical specifications.
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