Applications Processor, System on Chip (SoC) featuring an ARM1136JF-S core, operating at a maximum clock rate of 532 MHz. This 32-bit device utilizes 0.09um process technology, offering 128KB RAM and 32KB ROM. Housed in a 400-pin MAP-BGA package with a 0.8mm pin pitch, it supports surface mount installation and includes interfaces for CAN, Ethernet (MII, 10/100Mbps), I2C, I2S, SPI, UART, and USB. Designed for multimedia applications, it operates within a temperature range of -20 °C to 70 °C.
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NXP MCIMX353DJQ5C technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | MAP-BGA |
| Package Description | Molded Array Process Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 400 |
| PCB | 400 |
| Package Length (mm) | 17 |
| Package Width (mm) | 17 |
| Package Height (mm) | 1.18 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | i.MX35 |
| Device Core | ARM1136JF-S |
| Maximum Clock Rate | 532MHz |
| Program Memory Type | ROM |
| Data Bus Width | 32bit |
| Maximum Speed | 532MHz |
| Program Memory Size | 32KB |
| Process Technology | 0.09um |
| RAM Size | 128KB |
| Type | Applications Processor |
| Processing Unit | Microprocessor |
| Max Operating Supply Voltage | 1.47V |
| Application | Multimedia |
| Min Operating Temperature | -20°C |
| Max Operating Temperature | 70°C |
| Interface Type | CAN/Ethernet/I2C/I2S/SPI/SSI/UART/USB |
| SPI | 2 |
| I2C | 3 |
| I2S | 2 |
| UART | 3 |
| USB | 2 |
| USART | 0 |
| CAN | 2 |
| Ethernet | 1 |
| Number of Timers | 1 |
| Programmability | Yes |
| Core Architecture | ARM |
| Ethernet Interface Type | MII |
| Ethernet Speed | 10Mbps/100Mbps |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A992.c |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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