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Technical Specifications
NXP MCIMX357DVM5BR2 technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
32b
Halogen Free
Halogen Free
Max Operating Temperature
70°C
Min Operating Temperature
-20°C
Max Supply Voltage
1.47V
Memory Type
ROM, L2 Cache
Min Supply Voltage
1.33V
Mount
Surface Mount
Number of Cores
1
Package Quantity
1000
Packaging
Tape and Reel
Radiation Hardening
No
RoHS Compliant
Yes
Series
i.MX35
Weight
0.029584oz
Compliance
RoHS
Compliant
Datasheet
NXP MCIMX357DVM5BR2 Datasheet
Download the complete datasheet for NXP MCIMX357DVM5BR2 to view detailed technical specifications.
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