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Technical Specifications
NXP MCIMX502EVM8B technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
32b
Halogen Free
Halogen Free
Interface
I2C, SPI, USB, I2S, UART
Max Frequency
800MHz
Max Operating Temperature
70°C
Memory Size
96KB
Memory Type
ROM, L2 Cache,
Min Operating Temperature
-20°C
Number of Cores
1
Operating Supply Voltage
1.275V
Package Quantity
450
Packaging
Tray
RAM Size
128KB
RoHS Compliant
Yes
Series
i.MX50
Weight
0.029584oz
Compliance
RoHS
Compliant
Datasheet
NXP MCIMX502EVM8B Datasheet
Download the complete datasheet for NXP MCIMX502EVM8B to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.