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Technical Specifications
NXP MCIMX507CVK8B technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
32b
Halogen Free
Halogen Free
Max Operating Temperature
70°C
Memory Type
ROM, L2 Cache
Min Operating Temperature
0°C
Number of Cores
1
Operating Supply Voltage
1.275V
Package Quantity
160
Packaging
Tray
RoHS Compliant
Yes
Series
i.MX50
Weight
0.020448oz
Compliance
RoHS
Compliant
Datasheet
NXP MCIMX507CVK8B Datasheet
Download the complete datasheet for NXP MCIMX507CVK8B to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.