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Technical Specifications
NXP MCIMX508CZK8B technical specifications.
General
Package/Case
VFBGA
Core Architecture
ARM
Halogen Free
Halogen Free
Interface
I2C, SPI, USB, Ethernet, IrDA, MMC, SD, UART, USART, EBI/EMI, 1-WIRE
Max Operating Temperature
70°C
Memory Type
External Program Memory,
Min Operating Temperature
0°C
Number of I/Os
192
Oscillator Type
Internal
Package Quantity
160
Packaging
Tray
Peripherals
POR, PWM, WDT, DMA, LCD
RoHS Compliant
Yes
Series
i.MX50
Weight
0.024149oz
Compliance
RoHS
Compliant
Datasheet
NXP MCIMX508CZK8B Datasheet
Download the complete datasheet for NXP MCIMX508CZK8B to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.