PackageFBGA
Quick Jump:
Technical Specifications
NXP MCIMX535DVV1B technical specifications.
General
Package/Case
FBGA
Core Architecture
ARM
Data Bus Width
32b
Halogen Free
Halogen Free
Max Operating Temperature
85°C
Memory Type
ROM, L2 Cache
Min Operating Temperature
-20°C
Number of Cores
1
Operating Supply Voltage
1.4V
Package Quantity
84
Packaging
Tray
Radiation Hardening
No
RoHS Compliant
Yes
Series
i.MX53
Compliance
RoHS
Compliant
Datasheet
NXP MCIMX535DVV1B Datasheet
Download the complete datasheet for NXP MCIMX535DVV1B to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
