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Technical Specifications
NXP MCIMX535DVV1CR2 technical specifications.
General
| Package/Case | FBGA |
| Core Architecture | ARM |
| Data Bus Width | 32b |
| Halogen Free | Halogen Free |
| Interface | I2C, USB, Ethernet, UART, SPI, I2S |
| Max Frequency | 180MHz |
| Max Operating Temperature | 85°C |
| Max Supply Voltage | 1.3V |
| Memory Size | 64KB |
| Memory Type | ROM, L2 Cache, |
| Min Operating Temperature | -20°C |
| Min Supply Voltage | 1.2V |
| Mount | Surface Mount |
| Number of Cores | 1 |
| Operating Supply Voltage | 1.25V |
| Package Quantity | 750 |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| RAM Size | 256KB |
| RoHS Compliant | Yes |
| Series | i.MX53 |
| Weight | 0.075349oz |
Compliance
| RoHS | Compliant |
Datasheet
NXP MCIMX535DVV1CR2 Datasheet
Download the complete datasheet for NXP MCIMX535DVV1CR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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