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Technical Specifications
NXP MCIMX536AVV8CR2 technical specifications.
General
| Package/Case | LFBGA |
| Core Architecture | ARM |
| Data Bus Width | 32b |
| Halogen Free | Halogen Free |
| Interface | I2C, USB, Ethernet, UART, SPI, MMC, SD, USART, EBI/EMI, 1-WIRE |
| Lead Free | Lead Free |
| Max Frequency | 800MHz |
| Max Operating Temperature | 125°C |
| Max Supply Voltage | 1.15V |
| Memory Type | ROM, L2 Cache, ROMless, |
| Min Operating Temperature | -40°C |
| Min Supply Voltage | 1.05V |
| Mount | Surface Mount |
| Oscillator Type | External |
| Package Quantity | 750 |
| Packaging | Tape and Reel |
| Peripherals | POR, PWM, WDT, DMA, LCD |
| Radiation Hardening | No |
| RAM Size | 256KB |
| RoHS Compliant | Yes |
| Series | i.MX31 |
| Weight | 0.075349oz |
Compliance
| RoHS | Compliant |
Datasheet
NXP MCIMX536AVV8CR2 Datasheet
Download the complete datasheet for NXP MCIMX536AVV8CR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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