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Technical Specifications
NXP MCM16Y1BGCFT16B1 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | QFP |
| Package Description | Quad Flat Package |
| Pin Count | 160 |
| PCB | 160 |
| Package Length (mm) | 28 |
| Package Width (mm) | 28 |
| Package Height (mm) | 4.9(Max) |
| Pin Pitch (mm) | 0.65 |
| Mounting | Surface Mount |
| Maximum Clock Rate | 16MHz |
| Maximum CPU Frequency | 16MHz |
| RAM Size | 2KB |
| Number of Programmable I/Os | 24 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| ADC Channels | 8 |
| Number of ADCs | Single |
Compliance
| Cage Code | H1R01 |
| EU RoHS | No |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP MCM16Y1BGCFT16B1 Datasheet
Download the complete datasheet for NXP MCM16Y1BGCFT16B1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.