PackageTO-270 W
MountingSurface Mount
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Technical Specifications
NXP MDE6IC7120NR1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
TO-270 W
Package/Case
TO-270 W
Lead Shape
Flat
Pin Count
17
PCB
17
Package Length (mm)
23.67(Max)
Package Width (mm)
9.07(Max)
Package Height (mm)
3.25(Max)
Seated Plane Height (mm)
3.25(Max)
Pin Pitch (mm)
1.02
Package Material
Plastic
Mounting
Surface Mount
Manufacturer Type
Power Amplifier
Number of Channels per Chip
2
Typical Output Power Range
30 to 60dBm
Maximum Operating Frequency
768MHz
Maximum Input VSWR
10(Typ)
Maximum Output VSWR
10(Typ)
Typical Power Gain
34.4@748MHzdB
Max Operating Temperature
225°C
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
HTS Code
8541290075
Schedule B
8541290080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MDE6IC7120NR1 Datasheet
Download the complete datasheet for NXP MDE6IC7120NR1 to view detailed technical specifications.
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