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Technical Specifications
NXP MDE6IC7120NR1 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | TO-270 W |
| Package/Case | TO-270 W |
| Lead Shape | Flat |
| Pin Count | 17 |
| PCB | 17 |
| Package Length (mm) | 23.67(Max) |
| Package Width (mm) | 9.07(Max) |
| Package Height (mm) | 3.25(Max) |
| Seated Plane Height (mm) | 3.25(Max) |
| Pin Pitch (mm) | 1.02 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Manufacturer Type | Power Amplifier |
| Number of Channels per Chip | 2 |
| Typical Output Power Range | 30 to 60dBm |
| Maximum Operating Frequency | 768MHz |
| Maximum Input VSWR | 10(Typ) |
| Maximum Output VSWR | 10(Typ) |
| Typical Power Gain | 34.4@748MHzdB |
| Max Operating Temperature | 225°C |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8541290075 |
| Schedule B | 8541290080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP MDE6IC7120NR1 Datasheet
Download the complete datasheet for NXP MDE6IC7120NR1 to view detailed technical specifications.
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