Quick Jump:
Technical Specifications
NXP MM908E624ACEW technical specifications.
General
Bandwidth
1MHz
Package/Case
SOIC
Core Architecture
HC08
Halogen Free
Halogen Free
Interface
SPI, SCI
Lead Free
Lead Free
Max Operating Temperature
85°C
Memory Type
FLASH
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
16
Package Quantity
26
Packaging
Rail/Tube
RoHS Compliant
Yes
Weight
0.027399oz
Compliance
RoHS
Compliant
Datasheet
NXP MM908E624ACEW Datasheet
Download the complete datasheet for NXP MM908E624ACEW to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
