Frequency8MHz
PackageSOIC
MountingSurface Mount
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Technical Specifications
NXP MM908E625ACDWB technical specifications.
General
Package/Case
SOIC
Core Architecture
HC08
Data Bus Width
8b
Halogen Free
Halogen Free
Interface
SPI, SCI
Max Frequency
8MHz
Max Operating Temperature
85°C
Memory Size
16KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
13
Number of Programmable I/O
54
Number of Timers/Counters
16
Operating Supply Voltage
5V
Package Quantity
26
Packaging
Rail/Tube
RAM Size
512B
RoHS Compliant
No
Compliance
RoHS
Not Compliant
Datasheet
NXP MM908E625ACDWB Datasheet
Download the complete datasheet for NXP MM908E625ACDWB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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