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Technical Specifications
NXP MM908E625ACEK technical specifications.
General
Package/Case
SOIC
Core Architecture
HC08
Data Bus Width
8b
Halogen Free
Halogen Free
Interface
SPI, SCI
Lead Free
Lead Free
Max Operating Temperature
85°C
Memory Size
16KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
13
Number of Programmable I/O
16
Operating Supply Voltage
18V
Packaging
Rail/Tube
RAM Size
512B
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
NXP MM908E625ACEK Datasheet
Download the complete datasheet for NXP MM908E625ACEK to view detailed technical specifications.
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