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Technical Specifications
NXP MM908E626AVPEK technical specifications.
General
Package/Case
SOIC
Core Architecture
HC08
Data Bus Width
8b
Interface
SPI, SCI
Max Frequency
8MHz
Max Operating Temperature
115°C
Memory Size
16KB
Memory Type
FLASH
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
13
Operating Supply Voltage
18V
Packaging
Rail/Tube
RAM Size
512B
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
NXP MM908E626AVPEK Datasheet
Download the complete datasheet for NXP MM908E626AVPEK to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.