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Technical Specifications
NXP MM912F634CV2APR2 technical specifications.
General
Package/Case
LQFP
Core Architecture
HCS12
Data Bus Width
16b
Halogen Free
Halogen Free
Interface
LIN, SCI, SPI
Max Frequency
16MHz
Max Operating Temperature
105°C
Memory Size
32KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
9
Number of Programmable I/O
6
Number of Timers/Counters
4
Operating Supply Voltage
27V
Package Quantity
2000
Packaging
Tape and Reel
Radiation Hardening
No
RAM Size
2KB
RoHS Compliant
Yes
Watchdog Timer
Yes
Weight
0.006972oz
Compliance
RoHS
Compliant
Datasheet
NXP MM912F634CV2APR2 Datasheet
Download the complete datasheet for NXP MM912F634CV2APR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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