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Technical Specifications
NXP MM912JP812AMAFR2 technical specifications.
General
| Package/Case | LQFP |
| Data Bus Width | 16b |
| Halogen Free | Halogen Free |
| Interface | SPI, CAN, SCI |
| Max Operating Temperature | 125°C |
| Max Power Dissipation | 1.7W |
| Memory Size | 128KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Number of I/Os | 8 |
| Number of Timers/Counters | 8 |
| Operating Supply Voltage | 36V |
| Package Quantity | 800 |
| Packaging | Tape and Reel |
| Power Dissipation | 1.7W |
| Radiation Hardening | No |
| RAM Size | 6KB |
| RoHS Compliant | Yes |
| Supply Current | 4A |
| Watchdog Timer | Yes |
| Weight | 0.025239oz |
Compliance
| RoHS | Compliant |
Datasheet
NXP MM912JP812AMAFR2 Datasheet
Download the complete datasheet for NXP MM912JP812AMAFR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.