Frequency66MHz
PackageBGA
MountingSurface Mount
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Technical Specifications
NXP MPC823ZQ66B2T technical specifications.
General
Package/Case
BGA
Core Architecture
PowerPC
Data Bus Width
32b
Frequency
66MHz
Halogen Free
Halogen Free
Interface
I2C, Serial, Ethernet, UART
Lead Free
Contains Lead
Max Frequency
66MHz
Max I/O Voltage
3.3V
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Mount
Surface Mount
Number of Cores
1
Operating Supply Voltage
3.3V
Package Quantity
300
Packaging
Tray
Radiation Hardening
No
RAM Size
8KB
RoHS Compliant
No
Series
MPC8xx
Weight
0.060814oz
Compliance
RoHS
Not CompliantNo
Datasheet
NXP MPC823ZQ66B2T Datasheet
Download the complete datasheet for NXP MPC823ZQ66B2T to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.