333MHz RISC 32-bit microprocessor featuring a single PowerQUICC II core. This surface-mount component utilizes a 0.13um process technology and is housed in a 480-pin TBGA package with a 1.27mm pin pitch. Operating at a maximum supply voltage of 1.6V, it supports a temperature range of 0°C to 105°C.
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NXP MPC8280ZUQLD technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TBGA |
| Package Description | Thin Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 480 |
| PCB | 480 |
| Package Length (mm) | 37.5 |
| Package Width (mm) | 37.5 |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.7(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-192BAT-1 |
| Family Name | PowerQUICC II MPC82xx Processor |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | PowerQUICC II |
| Maximum Speed | 333MHz |
| Process Technology | 0.13um |
| Number of CPU Cores | 1 |
| Max Operating Supply Voltage | 1.6V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 105°C |
| Cage Code | H1R01 |
| EU RoHS | No |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.2 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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