333MHz RISC 32-bit microprocessor featuring a single PowerQUICC II core. This surface-mount component utilizes a 0.13um process technology and is housed in a 480-pin TBGA package with a 1.27mm pin pitch. Operating at a maximum supply voltage of 1.6V, it supports a temperature range of 0°C to 105°C.
PackageTBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP MPC8280ZUQLD technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TBGA
Package Description
Thin Profile Ball Grid Array
Lead Shape
Ball
Pin Count
480
PCB
480
Package Length (mm)
37.5
Package Width (mm)
37.5
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.7(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-192BAT-1
Family Name
PowerQUICC II MPC82xx Processor
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
PowerQUICC II
Maximum Speed
333MHz
Process Technology
0.13um
Number of CPU Cores
1
Max Operating Supply Voltage
1.6V
Min Operating Temperature
0°C
Max Operating Temperature
105°C
Compliance
Cage Code
H1R01
EU RoHS
No
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MPC8280ZUQLD Datasheet
Download the complete datasheet for NXP MPC8280ZUQLD to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.