32-bit RISC microprocessor, 800MHz, 0.09um process technology, featuring a single e300 core with 32KB instruction and 32KB data cache. Surface mountable in a 689-pin TEBGA II package (31x31x1.73mm) with a 1mm pin pitch. Supports Ethernet (MII/RMII/RGMII, 10/100/1000Mbps), I2C, SPI, UART, and USB interfaces. Operates with a maximum supply voltage of 1.1V and a temperature range of -40°C to 125°C.
PackageTEBGA II
MountingSurface Mount
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Technical Specifications
NXP MPC8379ECVRANG technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TEBGA II
Lead Shape
Ball
Pin Count
689
PCB
689
Package Length (mm)
31
Package Width (mm)
31
Package Height (mm)
1.73
Seated Plane Height (mm)
2.46(Max)
Pin Pitch (mm)
1
Package Weight (g)
4.7431
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAL-1
Family Name
PowerQUICC II Pro MPC83xx Processor
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
e300
Maximum Speed
800MHz
Process Technology
0.09um
Number of CPU Cores
1
Interface Type
Ethernet/I2C/SPI/UART/USB
CAN
0
UART
2
USART
0
I2C
2
SPI
1
USB
1
Ethernet
1
I2S
0
Max Operating Supply Voltage
1.1V
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Instruction Cache Size
32KB
Data Cache Size
32KB
Multiply Accumulate
No
Ethernet Interface Type
MII/RMII/RGMII
Ethernet Speed
10Mbps/100Mbps/1000Mbps
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A002
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MPC8379ECVRANG Datasheet
Download the complete datasheet for NXP MPC8379ECVRANG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.