32-bit RISC microprocessor, 800MHz, 0.09um process technology, featuring a single e300 core with 32KB instruction and 32KB data cache. Surface mountable in a 689-pin TEBGA II package (31x31x1.73mm) with a 1mm pin pitch. Supports Ethernet (MII/RMII/RGMII, 10/100/1000Mbps), I2C, SPI, UART, and USB interfaces. Operates with a maximum supply voltage of 1.1V and a temperature range of -40°C to 125°C.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TEBGA II |
| Lead Shape | Ball |
| Pin Count | 689 |
| PCB | 689 |
| Package Length (mm) | 31 |
| Package Width (mm) | 31 |
| Package Height (mm) | 1.73 |
| Seated Plane Height (mm) | 2.46(Max) |
| Pin Pitch (mm) | 1 |
| Package Weight (g) | 4.7431 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAL-1 |
| Family Name | PowerQUICC II Pro MPC83xx Processor |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | e300 |
| Maximum Speed | 800MHz |
| Process Technology | 0.09um |
| Number of CPU Cores | 1 |
| Interface Type | Ethernet/I2C/SPI/UART/USB |
| CAN | 0 |
| UART | 2 |
| USART | 0 |
| I2C | 2 |
| SPI | 1 |
| USB | 1 |
| Ethernet | 1 |
| I2S | 0 |
| Max Operating Supply Voltage | 1.1V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
| Instruction Cache Size | 32KB |
| Data Cache Size | 32KB |
| Multiply Accumulate | No |
| Ethernet Interface Type | MII/RMII/RGMII |
| Ethernet Speed | 10Mbps/100Mbps/1000Mbps |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A002 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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