Frequency50MHz
PackageBGA
MountingSurface Mount
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Technical Specifications
NXP MPC850DEVR50BUR2 technical specifications.
General
Package/Case
BGA
Data Bus Width
32b
Frequency
50MHz
Halogen Free
Not Halogen Free
Lead Free
Lead Free
Max Frequency
50MHz
Max I/O Voltage
3.3V
Max Operating Temperature
95°C
Min Operating Temperature
0°C
Max Supply Voltage
3.465V
Min Supply Voltage
3.135V
Mount
Surface Mount
Number of Cores
1
Operating Supply Voltage
3.3V
Package Quantity
500
Packaging
Tape and Reel
Radiation Hardening
No
RAM Size
8KB
RoHS Compliant
Yes
Series
MPC8xx
Weight
0.058659oz
Compliance
RoHS
Compliant
Datasheet
NXP MPC850DEVR50BUR2 Datasheet
Download the complete datasheet for NXP MPC850DEVR50BUR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.