32-bit RISC microprocessor, featuring a single e500 core operating at 533 MHz with 32KB instruction and 32KB data cache. This surface-mount component utilizes 0.13um process technology and is housed in a 783-pin BGA package measuring 29x29x2.55mm. It supports I2C/UART interfaces and offers Ethernet speeds of 10Mbps/100Mbps/1000Mbps, with a maximum operating supply voltage of 1.26V. Operating temperature range is 0°C to 105°C.
PackageBGA
MountingSurface Mount
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Technical Specifications
NXP MPC8540PX533JB technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
783
PCB
783
Package Length (mm)
29
Package Width (mm)
29
Package Height (mm)
2.55
Seated Plane Height (mm)
3.85
Package Material
Plastic
Mounting
Surface Mount
Family Name
PowerQUICC III MPC85xx Processor
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
e500
Maximum Speed
533MHz
Process Technology
0.13um
Number of CPU Cores
1
Interface Type
I2C/UART
Ethernet
0
Max Operating Supply Voltage
1.26V
Min Operating Temperature
0°C
Max Operating Temperature
105°C
Instruction Cache Size
32KB
Data Cache Size
32KB
Multiply Accumulate
No
Ethernet Speed
10Mbps/100Mbps/1000Mbps
Compliance
Cage Code
H1R01
EU RoHS
No
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A991
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MPC8540PX533JB Datasheet
Download the complete datasheet for NXP MPC8540PX533JB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.