1GHz 32-bit RISC microprocessor, featuring a single e500 core with 32KB instruction and 32KB data cache. This Flip Chip Ball Grid Array (FCBGA) component offers 783 pins on a 1mm pitch, surface-mount design, and supports Ethernet (MII/RMII/RGMII, 10/100/1000Mbps), I2C, and UART interfaces. Operating within a 0°C to 105°C temperature range, it utilizes 0.09um process technology and accommodates multiple supply voltages.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
NXP MPC8545PXAQGD technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
783
PCB
783
Package Length (mm)
29
Package Width (mm)
29
Package Height (mm)
2.78(Max)
Seated Plane Height (mm)
3.38(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Family Name
PowerQUICC III
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
e500
Maximum Speed
1000MHz
Process Technology
0.09um
Core Architecture
e500
Number of CPU Cores
1
Interface Type
Ethernet/I2C/UART
CAN
0
UART
2
USART
0
I2C
2
SPI
0
USB
0
Ethernet
4
I2S
0
Max Operating Supply Voltage
1.155V
Min Operating Temperature
0°C
Max Operating Temperature
105°C
Instruction Cache Size
32KB
Data Cache Size
32KB
Multiply Accumulate
No
Ethernet Interface Type
MII/RMII/RGMII
Ethernet Speed
10Mbps/100Mbps/1000Mbps
Compliance
Cage Code
H1R01
EU RoHS
No
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MPC8545PXAQGD Datasheet
Download the complete datasheet for NXP MPC8545PXAQGD to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.