Frequency66MHz
PackageBGA
MountingSurface Mount
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Technical Specifications
NXP MPC855TCVR66D4 technical specifications.
General
Package/Case
BGA
Core Architecture
PowerPC
Data Bus Width
32b
Frequency
66MHz
Halogen Free
Halogen Free
Lead Free
Lead Free
Max Frequency
66MHz
Max I/O Voltage
3.3V
Max Operating Temperature
95°C
Min Operating Temperature
-40°C
Max Supply Voltage
3.3V
Min Supply Voltage
2V
Mount
Surface Mount
Number of Cores
1
Package Quantity
44
Packaging
Tray
RAM Size
8KB
RoHS Compliant
Yes
Series
MPC8xx
Weight
0.073952oz
Compliance
RoHS
Compliant
Datasheet
NXP MPC855TCVR66D4 Datasheet
Download the complete datasheet for NXP MPC855TCVR66D4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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