32-bit RISC microprocessor featuring a 1.2GHz clock speed and dual e500 cores. This Flip Chip Ball Grid Array (FCBGA) package offers 1023 pins with a 1mm pitch, designed for surface mounting. It operates with a maximum supply voltage of 1.155V and includes 32KB instruction and data caches. Key interfaces include I2C and UART, with a wide operating temperature range of -40°C to 105°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
NXP MPC8572ECLPXATLD technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 1023 |
| PCB | 1023 |
| Package Length (mm) | 33 |
| Package Width (mm) | 33 |
| Package Height (mm) | 2.78(Max) |
| Seated Plane Height (mm) | 3.38(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | PowerQUICC III MPC85xx Processor |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | e500 |
| Maximum Speed | 1200MHz |
| Process Technology | 0.09um |
| Number of CPU Cores | 2 |
| Interface Type | I2C/UART |
| CAN | 0 |
| UART | 2 |
| USART | 0 |
| I2C | 1 |
| SPI | 0 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 1.155V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 105°C |
| Instruction Cache Size | 32KB |
| Data Cache Size | 32KB |
| Multiply Accumulate | No |
| Ethernet Speed | 10Mbps/100Mbps/1000Mbps |
Compliance
| Cage Code | H1R01 |
| EU RoHS | No |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A002.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP MPC8572ECLPXATLD Datasheet
Download the complete datasheet for NXP MPC8572ECLPXATLD to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.