Frequency50MHz
PackageBGA
MountingSurface Mount
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Technical Specifications
NXP MPC859DSLCZP50A technical specifications.
General
Access Time
50us
Package/Case
BGA
Core Architecture
PowerPC
Data Bus Width
32b
Frequency
50MHz
Halogen Free
Halogen Free
Lead Free
Contains Lead
Max Frequency
50MHz
Max Operating Temperature
100°C
Min Operating Temperature
-40°C
Max Supply Voltage
1.9V
Min Supply Voltage
1.7V
Mount
Surface Mount
Number of Cores
1
Operating Supply Voltage
1.8V
Package Quantity
220
Packaging
Tray
RAM Size
8KB
RoHS Compliant
No
Series
MPC8xx
Weight
0.079984oz
Compliance
RoHS
Not Compliant
Datasheet
NXP MPC859DSLCZP50A Datasheet
Download the complete datasheet for NXP MPC859DSLCZP50A to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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