
32-bit RISC microprocessor featuring a PowerQUICC MPC8xx core, operating at 100 MHz with a 0.18um process technology. This single-core MPU offers 4KB instruction and 4KB data cache, with I2C, SPI, and UART interfaces. Packaged in a 357-pin BGA (25mm x 25mm x 1.82mm) for surface mounting, it supports a supply voltage range of 1.9V to 3.465V and operates from -40°C to 100°C.
NXP MPC866TCZP100 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 357 |
| PCB | 357 |
| Package Length (mm) | 25 |
| Package Width (mm) | 25 |
| Package Height (mm) | 1.82(Max) |
| Seated Plane Height (mm) | 2.52(Max) |
| Package Weight (g) | 2.1737 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | PowerQUICC MPC8xx Processor |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | PowerQUICC |
| Maximum Speed | 100MHz |
| Process Technology | 0.18um |
| Number of CPU Cores | 1 |
| Interface Type | I2C/SPI/UART |
| Max Operating Supply Voltage | 1.9|3.465V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Instruction Cache Size | 4KB |
| Data Cache Size | 4KB |
| Multiply Accumulate | No |
| Cage Code | H1R01 |
| EU RoHS | No |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A991 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP MPC866TCZP100 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.