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Technical Specifications
NXP MRF8P9300HR6 technical specifications.
General
| Package/Case | NI-1230 |
| Pin Count | 5 |
| PCB | 5 |
| Package Length (mm) | 41.28(Max) |
| Package Width (mm) | 10.29(Max) |
| Package Height (mm) | 5.08(Max) |
| Seated Plane Height (mm) | 5.08(Max) |
| Pin Pitch (mm) | 13.72 |
| Package Material | Plastic |
| Mounting | Screw |
| Channel Type | N |
| Channel Mode | Enhancement |
| Number of Elements per Chip | 2 |
| Maximum Drain Source Voltage | 70V |
| Minimum Frequency | 860MHz |
| Maximum Frequency | 960MHz |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 225°C |
| Mode of Operation | 1-Carrier W-CDMA |
| Typical Power Gain | 19.6dB |
| Output Power | 100(Typ)W |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8541290075 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP MRF8P9300HR6 Datasheet
Download the complete datasheet for NXP MRF8P9300HR6 to view detailed technical specifications.
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