PackageNI-1230S
MountingSurface Mount
Power100(Typ)W
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Technical Specifications
NXP MRF8P9300HSR6 technical specifications.
General
Package/Case
NI-1230S
Pin Count
5
PCB
5
Package Length (mm)
32.38(Max)
Package Width (mm)
10.29(Max)
Package Height (mm)
5.08(Max)
Seated Plane Height (mm)
5.08(Max)
Pin Pitch (mm)
13.72
Mounting
Surface Mount
Channel Type
N
Channel Mode
Enhancement
Number of Elements per Chip
2
Maximum Drain Source Voltage
70V
Minimum Frequency
860MHz
Maximum Frequency
960MHz
Min Operating Temperature
-65°C
Max Operating Temperature
225°C
Mode of Operation
1-Carrier W-CDMA
Typical Power Gain
19.6dB
Output Power
100(Typ)W
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8541290075
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MRF8P9300HSR6 Datasheet
Download the complete datasheet for NXP MRF8P9300HSR6 to view detailed technical specifications.
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