PackageCase 465C-02
MountingSurface Mount
Power75(Typ)W
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Technical Specifications
NXP MRF8S9260HSR3 technical specifications.
General
Package/Case
Case 465C-02
Pin Count
3
PCB
3
Package Length (mm)
23.24(Max)
Package Width (mm)
13.8(Max)
Package Height (mm)
5.08(Max)
Seated Plane Height (mm)
5.08(Max)
Mounting
Surface Mount
Channel Type
N
Configuration
Single
Channel Mode
Enhancement
Number of Elements per Chip
1
Maximum Drain Source Voltage
70V
Minimum Frequency
865MHz
Maximum Frequency
960MHz
Min Operating Temperature
-65°C
Max Operating Temperature
225°C
Mode of Operation
1-Carrier W-CDMA|CDMA|GSM
Typical Power Gain
18.8dB
Output Power
75(Typ)W
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8541290075
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MRF8S9260HSR3 Datasheet
Download the complete datasheet for NXP MRF8S9260HSR3 to view detailed technical specifications.
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