High-performance 32/64-bit Digital Signal Processor (DSP) operating at 1GHz, delivering 1000 MIPS. Features a 783-pin Flip Chip Ball Grid Array (FCBGA) package with a 29mm x 29mm footprint and 1mm pin pitch. Includes 96KB of ROM for program memory and operates at a typical 1V supply voltage. Designed for surface mount applications with a temperature range of 0°C to 105°C.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the NXP MSC8157SVT1000A datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 783 |
| PCB | 783 |
| Package Length (mm) | 29 |
| Package Width (mm) | 29 |
| Package Height (mm) | 3.34(Max) |
| Seated Plane Height (mm) | 3.94(Max) |
| Pin Pitch (mm) | 1 |
| Package Weight (g) | 11.151 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Data Bus Width | 32|64bit |
| Program Memory Type | ROM |
| Program Memory Size | 96KB |
| Maximum Speed | 1000MHz |
| Device Million Instructions per Second | 1000MIPS |
| Device Input Clock Speed | 1000MHz |
| Typical Operating Supply Voltage | 1V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 105°C |
| Programmability | No |
| Cage Code | H1R01 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.2 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP MSC8157SVT1000A to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
