High-performance 32/64-bit digital signal processor operating at 1GHz, delivering 1000 MIPS. Features 96KB ROM program memory and a 783-pin Flip Chip Ball Grid Array (FCBGA) package for surface mounting. This component boasts a 1V typical operating supply voltage and operates across a temperature range of -40°C to 105°C. The 29mm x 29mm FCBGA package has a 1mm pin pitch and a maximum height of 3.34mm.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 783 |
| PCB | 783 |
| Package Length (mm) | 29 |
| Package Width (mm) | 29 |
| Package Height (mm) | 3.34(Max) |
| Seated Plane Height (mm) | 3.94(Max) |
| Pin Pitch (mm) | 1 |
| Package Weight (g) | 11.151 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Data Bus Width | 32|64bit |
| Program Memory Type | ROM |
| Program Memory Size | 96KB |
| Maximum Speed | 1000MHz |
| Device Million Instructions per Second | 1000MIPS |
| Device Input Clock Speed | 1000MHz |
| Typical Operating Supply Voltage | 1V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 105°C |
| Programmability | No |
| Cage Code | H1R01 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.2 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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