High-performance 32/64-bit digital signal processor operating at 1GHz, delivering 1000 MIPS. Features 96KB ROM program memory and a 783-pin Flip Chip Ball Grid Array (FCBGA) package for surface mounting. This component boasts a 1V typical operating supply voltage and operates across a temperature range of -40°C to 105°C. The 29mm x 29mm FCBGA package has a 1mm pin pitch and a maximum height of 3.34mm.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
NXP MSC8157TVT1000A technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
783
PCB
783
Package Length (mm)
29
Package Width (mm)
29
Package Height (mm)
3.34(Max)
Seated Plane Height (mm)
3.94(Max)
Pin Pitch (mm)
1
Package Weight (g)
11.151
Package Material
Plastic
Mounting
Surface Mount
Data Bus Width
32|64bit
Program Memory Type
ROM
Program Memory Size
96KB
Maximum Speed
1000MHz
Device Million Instructions per Second
1000MIPS
Device Input Clock Speed
1000MHz
Typical Operating Supply Voltage
1V
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
Programmability
No
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MSC8157TVT1000A Datasheet
Download the complete datasheet for NXP MSC8157TVT1000A to view detailed technical specifications.
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