The NE5560D,118 is a 16-pin SO lead-frame SMT supervisory circuit from NXP. It features a small outline IC package with gull-wing leads and a surface mount configuration. The device is rated for use in surface mount applications and is packaged in a plastic case with a maximum package length of 10.5mm, width of 7.6mm, and height of 2.45mm. The pin pitch is 1.27mm and the package material is plastic. The NE5560D,118 is compliant with the Jedec MS-013AA standard.
PackageSO
MountingSurface Mount
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Technical Specifications
NXP NE5560D,118 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SO |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 10.5(Max) |
| Package Width (mm) | 7.6(Max) |
| Package Height (mm) | 2.45(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-013AA |
Compliance
| Cage Code | H1R01 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
NXP NE5560D,118 Datasheet
Download the complete datasheet for NXP NE5560D,118 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.