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Technical Specifications
NXP NE570N technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
16
PCB
16
Package Length (mm)
19.5(Max)
Package Width (mm)
6.48(Max)
Package Height (mm)
3.2(Max)
Seated Plane Height (mm)
4.2(Max)
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Compliance
Cage Code
H1R01
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
NXP NE570N Datasheet
Download the complete datasheet for NXP NE570N to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.