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Technical Specifications
NXP NE571D technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SO
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
10.5(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.45(Max)
Seated Plane Height (mm)
2.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-013
Compliance
Cage Code
H1R01
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
NXP NE571D Datasheet
Download the complete datasheet for NXP NE571D to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.