The NXP NE571D is a specialized telecom IC packaged in a 16-pin SO lead-frame SMT package. It has a maximum package length of 10.5mm, width of 7.6mm, and height of 2.45mm. The seated plane height is 2.65mm, with a pin pitch of 1.27mm. The package is made of plastic and is designed for surface mount applications, conforming to the Jedec MS-013 standard.
PackageSO
MountingSurface Mount
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Technical Specifications
NXP NE571D technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SO |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 10.5(Max) |
| Package Width (mm) | 7.6(Max) |
| Package Height (mm) | 2.45(Max) |
| Seated Plane Height (mm) | 2.65(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-013 |
Compliance
| Cage Code | H1R01 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Datasheet
NXP NE571D Datasheet
Download the complete datasheet for NXP NE571D to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.