The NXP NE571F is a specialized telecom IC available in a 16-pin CDIP package with a ceramic material and through hole mounting. It features a seated plane height of up to 5.08mm and a pin pitch of 2.54mm. The package dimensions are 19.94mm in length and 7.77mm in width, with a maximum pin count of 16. The IC is suitable for use in through hole mounting applications.
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| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | CDIP |
| Package Description | Ceramic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 19.94(Max) |
| Package Width (mm) | 7.77(Max) |
| Seated Plane Height (mm) | 5.08(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Material | Ceramic |
| Mounting | Through Hole |
| Cage Code | H1R01 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Download the complete datasheet for NXP NE571F to view detailed technical specifications.
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