The NTBA104BQ,115 is a logic translator from NXP, packaged in a 14-pin QFN non-lead-frame SMT package. It features a depopulated heat sink very thin quad flat no lead package with an exposed pad. The package measures 3.1mm in length, 2.6mm in width, and 0.95mm in height, with a seated plane height of 1mm and a pin pitch of 0.5mm. The device is designed for surface mount applications and is compliant with Jedec MO-241 standards.
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NXP NTBA104BQ,115 technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | DHVQFN EP |
| Package Description | Depopulated Heat Sink Very Thin Quad Flat No Lead Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 3.1(Max) |
| Package Width (mm) | 2.6(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-241 |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP NTBA104BQ,115 to view detailed technical specifications.
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